ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,735, issued on Dec. 9, was assigned to Intel Corp. (Santa Clara, Calif.).
"Semiconductor void placement" was invented by Prakaram Joshi (Gilbert, Ariz.), Todd Snider (Mesa, Ariz.) and Srinivas Moola (Phoenix).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of semiconductor modelling includes determining for a virtual model of a layer of a semiconductor package, wherein the layer includes a metal layer, one or more first regions of the layer that do not satisfy a first layer design rule; adding first voids to the one or more first regions to satisfy the first layer design rule; determining for the layer including the metal pattern and the first...