US Patent Issued to Intel on Dec. 9 for "Liquid metal interconnect for modular system on an interposer server architecture" (Oregon, Washington, Arizona Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,435, issued on Dec. 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Liquid metal interconnect for modular system on an interposer server architecture" was invented by Karumbu Meyyappan (Portland, Ore.), Jeffory L. Smalley (East Olympia, Wash.), Gregorio Murtagian (Phoenix), Srikant Nekkanty (Chandler, Ariz.), Pooya Tadayon (Portland, Ore.), Eric J.M. Moret (Beaverton, Ore.) and Bijoyraj Sahu (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic system and associated methods are disclosed. In one example, the electronic system includes an interposer including electrically conductive interposer interconnect, a first interp...