US Patent Issued to Intel on Dec. 9 for "Flex-PCB integrated packaging for silicon photonics LiDAR" (California Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,487, issued on Dec. 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Flex-PCB integrated packaging for silicon photonics LiDAR" was invented by Sanjeev Gupta (Santa Rosa, Calif.) and Jin Hong (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an...