US Patent Issued to Intel on Dec. 9 for "BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load" (Oregon, Washington, Arizona Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,441, issued on Dec. 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load" was invented by Phil Geng (Washougal, Wash.), Patrick Nardi (Scottsdale, Ariz.), Ravindranath V. Mahajan (Chandler, Ariz.), Dingying David Xu (Chandler, Ariz.), Prasanna Raghavan (Chandler, Ariz.), John Harper (Chandler, Ariz.), Sanjoy Saha (Portland, Ore.) and Yang Jiao (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package subs...