US Patent Issued to Intel on Dec. 30 for "Vertical interconnect design for improved electrical performance" (Malaysian Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,414, issued on Dec. 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Vertical interconnect design for improved electrical performance" was invented by Jackson Chung Peng Kong (Pulau Pinang, Malaysia), Bok Eng Cheah (Pulau Pinang, Malaysia), Kok Hou Teh (Bayan Lepas, Malaysia), Kooi Chi Ooi (Pulau Pinang, Malaysia) and Li Wern Chew (Penang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure generally relates to a printed circuit board assembly that may include a circuit board having a first surface and an opposing second surface. The printed circuit board assembly may also include a first interconnect barrel dispose...