US Patent Issued to Intel on Dec. 30 for "Substrates having adhesion promotor layers and related methods" (Arizona Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,397, issued on Dec. 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Substrates having adhesion promotor layers and related methods" was invented by Yi Yang (Gilbert, Ariz.), Suddhasattwa Nad (Chandler, Ariz.), Xiaoying Guo (Chandler, Ariz.), Jieying Kong (Chandler, Ariz.), Ala Omer (Phoenix), Christy Sennavongsa (Gilbert, Ariz.), Wei Wei (Chandler, Ariz.) and Ao Wang (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Substrate assemblies having adhesion promotor layers and related methods are disclosed. An example apparatus includes a substrate, a dielectric layer, a first copper layer between the substrate and the dielectric la...