ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,970, issued on Dec. 30, was assigned to Intel Corp. (Santa Clara, Calif.).
"Integrated circuits with tungsten interconnect liners" was invented by Travis W. Lajoie (Forest Grove, Ore.), Pei-hua Wang (Beaverton, Ore.), Gregory J. George (Beaverton, Ore.), Bernhard Sell (Portland, Ore.), Juan G. Alzate-Vinasco (Tigard, Ore.), Chieh-Jen Ku (Portland, Ore.) and Alekhya Nimmagadda (Hillsboro, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein are integrated circuit devices with semiconductor devices and interconnects coupled to contacts of the semiconductor devices, where the interconnects have tungsten liners between a fill material of...