US Patent Issued to Intel on Dec. 30 for "Integrated circuit interconnect structures with a metal chalcogenide liner" (Oregon, California Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,365, issued on Dec. 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit interconnect structures with a metal chalcogenide liner" was invented by Abhishek Anil Sharma (Portland, Ore.), Wilfred Gomes (Portland, Ore.) and Pushkar Ranade (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit interconnect structures including an interconnect metallization feature comprising a sidewall reacted with a chalcogen into a low resistance liner. A portion of a backbone material or a metal seed layer may be advantageously converted into a metal chalcogenide, which can lower scattering resistance of an interconne...