US Patent Issued to Intel on Dec. 30 for "Flexible die to floor planning with bump pitch scale through glass core via pitch" (Arizona Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,396, issued on Dec. 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Flexible die to floor planning with bump pitch scale through glass core via pitch" was invented by Andrew Collins (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Tarek A. Ibrahim (Mesa, Ariz.), Aleksandar Aleksov (Chandler, Ariz.) and Telesphor Kamgaing (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include disaggregated die modules. In an embodiment, a disaggregated die module comprises a plurality of core logic blocks. In an embodiment, the disaggregated die module further comprises a first IO interface, where the...