ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,581, issued on Dec. 23, was assigned to Intel Corp. (Santa Clara, Calif.).
"Photonic interconnect and components in glass" was invented by Kristof Darmawikarta (Chandler, Ariz.), Benjamin Duong (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Tarek A. Ibrahim (Mesa, Ariz.), Hari Mahalingam (San Jose, Calif.) and Bai Nie (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages with photonics integrated circuits (PICs). In an embodiment, an electronic package comprises a glass substrate with a first recess and a second recess. In an embodiment, a PIC is in the first recess. I...