US Patent Issued to Intel on Dec. 23 for "Package architecture of photonic system with vertically stacked dies having planarized edges" (Oregon, Arizona, California Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,127, issued on Dec. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package architecture of photonic system with vertically stacked dies having planarized edges" was invented by Sagar Suthram (Portland, Ore.), Ravindranath Vithal Mahajan (Chandler, Ariz.), Debendra Mallik (Chandler, Ariz.), Omkar G. Karhade (Chandler, Ariz.), Wilfred Gomes (Portland, Ore.), Pushkar Sharad Ranade (San Jose, Calif.), Abhishek A. Sharma (Hillsboro, Ore.), Tahir Ghani (Portland, Ore.), Anand S. Murthy (Portland, Ore.) and Nitin A. Deshpande (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of an integrated circuit (IC) die comprise a fi...