US Patent Issued to Intel on Dec. 23 for "Flexible and modular top and bottom side processor unit module cooling" (Mexican, American Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,799, issued on Dec. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Flexible and modular top and bottom side processor unit module cooling" was invented by Andres Ramirez Macias (Zapopan, Mexico), Aardra B. Athalye (Beaverton, Ore.), Devdatta Prakash Kulkarni (Portland, Ore.), Gilberto Rayas Paredes (Zapopan, Mexico) and Bijoyraj Sahu (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Flexible and modular top and bottom side processor unit module cooling is disclosed. An example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic com...