US Patent Issued to Intel on Dec. 2 for "Micro-channel heatsink with embedded heater and diamond heat spreader" (Oregon Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,277, issued on Dec. 2, was assigned to Intel Corp. (Santa Clara, Calif.).

"Micro-channel heatsink with embedded heater and diamond heat spreader" was invented by Alexander I. Mamchik (Hillsboro, Ore.), Jaime A. Sanchez (Beaverton, Ore.), Sachin Gupta (Sherwood, Ore.) and Matthew C. Zeman (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a high-performance thermal chuck for enhanced thermal management of high-power integrated circuit (IC) devices. The disclosed high-performance thermal chuck provides active heating and cooling for post-manufacture device testing. A high-performance heatsink comprises microfluidic chann...