US Patent Issued to Intel on Dec. 2 for "Circuit devices integrated with boiling enhancement for two-phase immersion cooling" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,410, issued on Dec. 2, was assigned to Intel Corp. (Santa Clara, Calif.).

"Circuit devices integrated with boiling enhancement for two-phase immersion cooling" was invented by David Shia (Portland, Ore.), Jin Yang (Hillsboro, Ore.), Jimmy Chuang (Taipei, Taiwan), Mohanraj Prabjugoud (Hillsboro, Ore.) and Michael T. Crocker (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device includes at least one surface and at least one proj...