US Patent Issued to Intel on Dec. 16 for "Thermal solutions for cooling electronic devices" (Taiwanese, American, Malaysian Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,538, issued on Dec. 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Thermal solutions for cooling electronic devices" was invented by Jeff Ku (Taipei, Taiwan), Baomin Liu (Hillsboro, Ore.), Cora Nien (Taipei, Taiwan), Min Suet Lim (Gelugor, Malaysia) and Tongyan Zhai (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second sid...