US Patent Issued to Intel on Dec. 16 for "Integrated circuit structures having dielectric anchor void" (Oregon Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,659, issued on Dec. 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit structures having dielectric anchor void" was invented by Leonard P. Guler (Hillsboro, Ore.), Charles H. Wallace (Portland, Ore.) and Tahir Ghani (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit structures having a dielectric anchor void, and methods of fabricating integrated circuit structures having a dielectric anchor void, are described. For example, an integrated circuit structure includes a sub-fin in a shallow trench isolation (STI) structure. A plurality of horizontally stacked nanowires is over the sub-fin. A gate ...