ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,175, issued on Dec. 16, was assigned to Intel Corp. (Santa Clara, Calif.).
"Integrated bridge frame for package substrate" was invented by Bok Eng Cheah (Pulau Pinang, Malaysia), Seok Ling Lim (Kulim Kedah, Malaysia), Jenny Shio Yin Ong (Pulau Pinang, Malaysia), Jackson Chung Peng Kong (Pulau Pinang, Malaysia) and Kooi Chi Ooi (Pulau Pinang, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to multichip semiconductor packages, and methods for making them, which includes a package substrate with an integrated bridge frame having a first horizontal portion positioned on a top surface of the package substrate, w...