US Patent Issued to Intel on Aug. 5 for "Solderless or groundless electromagnetic shielding in electronic devices" (Indian Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,575, issued on Aug. 5, was assigned to Intel Corp. (Santa Clara, Calif.).

"Solderless or groundless electromagnetic shielding in electronic devices" was invented by Bala P. Subramanya (Bangalore, India), Prakash Kurma Raju (Bangalore, India), Navneet K. Singh (Bangalore, India), Sachin Bedare (Bangalore, India) and Vijith Halestoph R. (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component."

The patent ...