US Patent Issued to Intel on Aug. 5 for "Semiconductor dies and devices with frontside and backside coils for inductive coupling" (German Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,712, issued on Aug. 5, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor dies and devices with frontside and backside coils for inductive coupling" was invented by Peter Baumgartner (Munich), Joachim Assenmacher (Unterhaching, Germany), Walther Lutz (Erding, Germany), Martin Ostermayr (Woerth, Germany) and Georg Seidemann (Landshut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die is disclosed, including a plurality of transistors at a frontside of a semiconductor substrate, a backside inductor at a backside of the semiconductor substrate; and a frontside inductor at the frontside of the semiconductor substra...