ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,160, issued on Aug. 5, was assigned to Intel Corp. (Santa Clara, Calif.).
"Memory device package with noise shielding" was invented by Jaejin Lee (Beaverton, Ore.), Christopher E. Cox (Placerville, Calif.), Jun Liao (Portland, Ore.) and Xiang Li (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device includes a grounded molding. The memory device includes a substrate having a first surface for a memory die, where the substrate has ground vias through substrate to connect to a ground reference. The substrate has a ball grid array (BGA) on the opposite surface, including perimeter balls to connect to ground connections. The groun...