ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,182, issued on Aug. 5, was assigned to Intel Corp. (Santa Clara, Calif.).
"Direct bonding in microelectronic assemblies" was invented by Feras Eid (Chandler, Ariz.), Adel A. Elsherbini (Chandler, Ariz.), Aleksandar Aleksov (Chandler, Ariz.), Shawna M. Liff (Scottsdale, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronic assemblies including direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microele...