ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,334, issued on Aug. 26, was assigned to Intel Corp. (Santa Clara, Calif.).
"Photonic integrated circuit packaging architectures" was invented by Omkar G. Karhade (Chandler, Ariz.), Xiaoqian Li (Chandler, Ariz.) and Nitin A. Deshpande (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active side and an opposing backside, and wherein the PIC is embedded in the insulating ...