ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,997, issued on Aug. 26, was assigned to Intel Corp. (Santa Clara, Calif.).
"Hybrid manufacturing with modified via-last process" was invented by Abhishek A. Sharma (Hillsboro, Ore.), Wilfred Gomes (Portland, Ore.), Mauro J. Kobrinsky (Portland, Ore.), Doug B. Ingerly (Portland, Ore.) and Van H. Le (Beaverton, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies fabricated using hybrid manufacturing with modified via-last process are disclosed. The fabrication approach is based on using hybrid manufacturing to bond first and second IC structures originally provided on different dies but filling at least portions of vias that...