US Patent Issued to Intel on Aug. 26 for "Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact" (American, German Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,349, issued on Aug. 26, was assigned to Intel Corp. (Santa Clara, Calif.).

"Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact" was invented by Biswajeet Guha (Hillsboro, Ore.), William Hsu (Hillsboro, Ore.), Chung-Hsun Lin (Portland, Ore.), Kinyip Phoa (Beaverton, Ore.), Oleg Golonzka (Beaverton, Ore.), Ayan Kar (Portland, Ore.), Nicholas Thomson (Hillsboro, Ore.), Benjamin Orr (Munich), Nathan Jack (Forest Grove, Ore.), Kalyan Kolluru (Portland, Ore.) and Tahir Ghani (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Gate-all-around integrated circuit structures having devices with...