ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,202, issued on Aug. 19, was assigned to Intel Corp. (Santa Clara, Calif.).
"Radio frequency shielding within a semiconductor package" was invented by Edmund Goetz (Dachau, Germany), Bernd Memmler (Riemerling, Germany), Jan-Erik Mueller (Ottobrunn, Germany) and Peter Baumgartner (Munich).
According to the abstract* released by the U.S. Patent & Trademark Office: "Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip."
The patent was filed on ...