US Patent Issued to Intel on Aug. 19 for "Method to implement wafer-level chip-scale packages with grounded conformal shield" (German Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,726, issued on Aug. 19, was assigned to Intel Corp. (Santa Clara, Calif.).

"Method to implement wafer-level chip-scale packages with grounded conformal shield" was invented by Gianni Signorini (Garching bei Muenchen, Germany), Georg Seidemann (Landshut, Germany) and Bernd Waidhas (Pettendorf, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages with conformal shields and methods of forming such packages. In an embodiment, the electronic package comprises a die having a first surface, a second surface opposite the first surface, and sidewall surfaces. A redistribution layer is over the first ...