ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,999, issued on Aug. 12, was assigned to Intel Corp. (Santa Clara, Calif.).
"Planar integrated circuit package interconnects" was invented by Robert L. Sankman (Phoenix) and Sanka Ganesan (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Generally discussed herein are systems, methods, and apparatuses that include conductive pillars that are about co-planar. According to an example, a technique can include growing conductive pillars on respective exposed landing pads of a substrate, situating molding material around and on the grown conductive pillars, removing, simultaneously, a portion of the grown conductive pillars and the molding m...