US Patent Issued to Intel on Aug. 12 for "Extending multichip package link off package" (California, Oregon, Texas Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,768, issued on Aug. 12, was assigned to Intel Corp. (Santa Clara, Calif.).

"Extending multichip package link off package" was invented by Debendra Das Sharma (Saratoga, Calif.), Zuoguo Wu (San Jose, Calif.), Mahesh Wagh (Portland, Ore.), Mohiuddin M. Mazumder (San Jose, Calif.), Venkatraman Iyer (Austin, Texas) and Jeff C. Morriss (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect interface is provided to enable communication with an off-package device over a link including a plurality of lanes. Logic of the interconnect interface includes receiver logic to receive a valid signal from the off-package device on a dedica...