ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,051, issued on Aug. 12, was assigned to Intel Corp. (Santa Clara, Calif.).
"Barriers for grooves in photonics dies" was invented by Xiaoqian Li (Chandler, Ariz.), Wei Li (Chandler, Ariz.), Santosh Shaw (Chandler, Ariz.) and Jingyi Huang (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves."
The patent was filed on March 26, 2021, under Application No. 17/214,083.
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