ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,740, issued on April 29, was assigned to Intel Corp. (Santa Clara, Calif.).
"Semiconductor package with hybrid mold layers" was invented by Bok Eng Cheah (Gelugor, Malaysia), Chia Chuan Wu (Butterworth, Malaysia), Jackson Chung Peng Kong (Tanjung Tokong, Malaysia) and Kooi Chi Ooi (Bukit Gambir, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to various examples, a device is described. The device may include a first package substrate. The device may also include a first mold layer with a first thickness. The device may also include a second mold layer with a second thickness proximal to the first mold layer. The second thickness may...