US Patent Issued to Intel on April 29 for "Microelectronic assemblies having conductive structures with different thicknesses on a core substrate" (Arizona Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,744, issued on April 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies having conductive structures with different thicknesses on a core substrate" was invented by Ji Yong Park (Chandler, Ariz.), Kyu Oh Lee (Chandler, Ariz.), Yikang Deng (Chandler, Ariz.), Zhichao Zhang (Chandler, Ariz.), Liwei Cheng (Chandler, Ariz.), Andrew James Brown (Phoenix), Cheng Xu (Chandler, Ariz.) and Jiwei Sun (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package sub...