ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,751, issued on April 29, was assigned to Intel Corp. (Santa Clara, Calif.).
"Microelectronic assemblies" was invented by Aleksandar Aleksov (Chandler, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate including a dielectric material having a first surface and an opposing second surface, a first material on at least a portion of the second surface, and a second material on at least a portion of the first material, wherein the second mat...