US Patent Issued to Intel on April 29 for "Gate-all-around integrated circuit structures having insulator fin on insulator substrate" (Oregon Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,813, issued on April 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Gate-all-around integrated circuit structures having insulator fin on insulator substrate" was invented by Aaron D. Lilak (Beaverton, Ore.), Rishabh Mehandru (Portland, Ore.), Cory Weber (Hillsboro, Ore.), Willy Rachmady (Beaverton, Ore.) and Varun Mishra (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Gate-all-around integrated circuit structures having an insulator fin on an insulator substrate, and methods of fabricating gate-all-around integrated circuit structures having an insulator fin on an insulator substrate, are described. For example, an integrate...