US Patent Issued to Intel on April 29 for "Conformal power delivery structure for direct chip attach architectures" (Arizona Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,750, issued on April 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Conformal power delivery structure for direct chip attach architectures" was invented by William J. Lambert (Tempe, Ariz.), Beomseok Choi (Chandler, Ariz.), Krishna Bharath (Phoenix), Kaladhar Radhakrishnan (Chandler, Ariz.) and Adel Elsherbini (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, a base die apparatus includes a conformal power delivery structure comprising a first electrically conductive layer defining one or more recesses, and a second electrically conductive layer at least partially within the recesses of the first electricall...