US Patent Issued to Intel on April 29 for "Backside contact structures and fabrication for metal on both sides of devices" (Oregon Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,810, issued on April 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Backside contact structures and fabrication for metal on both sides of devices" was invented by Patrick Morrow (Portland, Ore.), Rishabh Mehandru (Portland, Ore.), Aaron D. Lilak (Beaverton, Ore.) and Kimin Jun (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus including a circuit structure including a device stratum including a plurality of devices including a first side and an opposite second side; and a metal interconnect coupled to at least one of the plurality of devices from the second side of the device stratum. A method including forming a t...