US Patent Issued to Intel on April 22 for "IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,535, issued on April 22, was assigned to Intel Corp. (Santa Clara, Calif.).

"IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects" was invented by Debendra Mallik (Chandler, Ariz.), Je-Young Chang (Tempe, Ariz.), Ram Viswanath (Phoenix), Elah Bozorg-Grayeli (Chandler, Ariz.) and Ahmad Al Mohammad (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and ...