US Patent Issued to Intel on April 15 for "Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention" (Washington, Oregon Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,279,395, issued on April 15, was assigned to Intel Corp. (Santa Clara, Calif.).

"Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention" was invented by Phil Geng (Washougal, Wash.), Ralph V. Miele (Hillsboro, Ore.), David Shia (Portland, Ore.), Jeffory L. Smalley (Olympia, Wash.), Eric W. Buddrius (Hillsboro, Ore.), Sean T. Sivapalan (Portland, Ore.), Olaotan Elenitoba-Johnson (Tigard, Ore.) and Mengqi Liu (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the ...