US Patent Issued to Intel on April 15 for "Hybrid manufacturing for integrated circuit devices and assemblies" (Oregon Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,229, issued on April 15, was assigned to Intel Corp. (Santa Clara, Calif.).

"Hybrid manufacturing for integrated circuit devices and assemblies" was invented by Wilfred Gomes (Portland, Ore.), Abhishek A. Sharma (Portland, Ore.), Mauro J. Kobrinsky (Portland, Ore.) and Doug B. Ingerly (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies fabricated using hybrid manufacturing, as well as related devices and methods, are disclosed herein. As used herein, "hybrid manufacturing" refers to fabricating a microelectronic assembly by arranging together at least two IC structures fabricated by different manufacturers, using...