US Patent Issued to Intel on April 1 for "Waveguide interconnects for semiconductor packages and related methods" (Arizona, California Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,840, issued on April 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Waveguide interconnects for semiconductor packages and related methods" was invented by Georgios Dogiamis (Chandler, Ariz.), Johanna Swan (Scottsdale, Ariz.), Adel Elsherbini (Tempe, Ariz.), Shawna Liff (Scottsdale, Ariz.), Beomseok Choi (Chandler, Ariz.) and Qiang Yu (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Waveguide interconnects for semiconductor packages are disclosed. An example semiconductor package includes a first semiconductor die, a second semiconductor die, and a substrate positioned between the first and second dies. The substrate includes...