US Patent Issued to Intel on April 1 for "Capacitors and resistors at direct bonding interfaces in microelectronic assemblies" (Arizona, Oregon, California Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,682, issued on April 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Capacitors and resistors at direct bonding interfaces in microelectronic assemblies" was invented by Adel A. Elsherbini (Tempe, Ariz.), Mohammad Enamul Kabir (Portland, Ore.), Zhiguo Qian (Chandler, Ariz.), Gerald S. Pasdast (San Jose, Calif.), Kimin Jun (Portland, Ore.), Shawna M. Liff (Scottsdale, Ariz.), Johanna M. Swan (Scottsdale, Ariz.), Aleksandar Aleksov (Chandler, Ariz.) and Feras Eid (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are capacitors and resistors at direct bonding interfaces in microelectronic assemblies, as well as rel...