US Patent Issued to Intel NDTM US on Dec. 30 for "Stitching to enable dense interconnect arrangements" (Oregon Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,407, issued on Dec. 30, was assigned to Intel NDTM US LLC (Rancho Cordova, Calif.).

"Stitching to enable dense interconnect arrangements" was invented by Guillaume Bouche (Portland, Ore.) and Andy Chih-Hung Wei (Yamhill, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for fabricating interconnect arrangements of a metallization layer Mx by using stitching that is enabled by subtractive metallization are disclosed. An example method includes providing a metal layer and a collection layer over the metal layer. The method then includes forming openings for two sets of metal lines by performing a first lithographic process to provide, in the...