US Patent Issued to Institute of Microelectronics, Chinese Academy of Sciences on Feb. 10 for "Metalized laminate having interconnection wires and electronic device having the same" (New York Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,717, issued on Feb. 10, was assigned to Institute of Microelectronics, Chinese Academy of Sciences (Beijing).

"Metalized laminate having interconnection wires and electronic device having the same" was invented by Huilong Zhu (Poughkeepsie, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metallic stack and a preparing method therefor, and an electronic device including the metallic stack. The metallic stack includes at least one interconnection wire layer and at least one via layer alternately arranged on a substrate. At least one pair of interconnection wire layer and via layer in the metallic stack includes interconnection wires in the inter...