US Patent Issued to Innolux on Sept. 23 for "Manufacturing method of package structure of electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,458, issued on Sept. 23, was assigned to Innolux Corp. (Miaoli County, Taiwan).

"Manufacturing method of package structure of electronic device" was invented by Cheng-Chi Wang (Miao-Li County, Taiwan), Chien-Feng Li (Miao-Li County, Taiwan) and Kuang-Ming Fan (Miao-Li County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a package structure of an electronic device is provided. The manufacturing method includes the following. First, a carrier plate is provided. The carrier plate includes a composite structure and has a first surface and a second surface opposite to each other. Next, an anti-warpage structure is form...