ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,919, issued on July 8, was assigned to Innolux Corp. (Miaoli County, Taiwan).
"Manufacturing method of package circuit" was invented by Yeong-E Chen (Miao-Li County, Taiwan), Bi-Ly Lin (Miao-Li County, Taiwan), Kuang Chiang Huang (Miao-Li County, Taiwan) and Yu Ting Liu (Miao-Li County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The embodiments of the disclosure provide a manufacturing method of a package circuit, including the following steps. A circuit structure including a plurality of conductive pads is formed. A liquid crystal layer is formed on the circuit structure. An inspection step is performed, and the inspection step includes d...