ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,224, issued on July 29, was assigned to InnoLux Corp. (Miao-Li County, Taiwan).
"Package device" was invented by Yi-Hung Lin (Miao-Li County, Taiwan), Chun-Hung Lai (Miao-Li County, Taiwan), Yeong-E Chen (Miao-Li County, Taiwan), Chuan-Ming Yeh (Miao-Li County, Taiwan) and Ching-Wei Chen (Miao-Li County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and...