US Patent Issued to INNOLUX on Jan. 27 for "Electronic device including bonding structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,527, issued on Jan. 27, was assigned to INNOLUX Corp. (Miao-Li County, Taiwan).

"Electronic device including bonding structure and method of manufacturing the same" was invented by Chueh-Yuan Nien (Miao-Li County, Taiwan), Chao-Chin Sung (Miao-Li County, Taiwan), Chao-Sen Yang (Miao-Li County, Taiwan), Chien-Tzu Chu (Miao-Li County, Taiwan), Yu-Chien Kao (Miao-Li County, Taiwan) and Li-Wei Sung (Miao-Li County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing an electronic device is provided. The method includes the following steps: providing a substrate; forming a thin-film transistor layer on the substrate; forming a...