US Patent Issued to INNOLUX on Dec. 2 for "Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layer" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,048, issued on Dec. 2, was assigned to INNOLUX Corp. (Miao-Li County, Taiwan).

"Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layer" was invented by Te-Hsun Lin (Miao-Li County, Taiwan), Wen-Hsiang Liao (Miao-Li County, Taiwan), Mei-Yen Chen (Miao-Li County, Taiwan), Ming-Hsien Shih (Miao-Li County, Taiwan), Yung-Feng Chen (Miao-Li County, Taiwan) and Cheng-Chi Wang (Miao-Li County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package device is provided. The semiconductor package device includes a chip and a redistribution layer disposed on the chip...