US Patent Issued to INNOGRATION (SUZHOU) on Dec. 2 for "Packaging structure and packaging method of high-power radio frequency device" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,079, issued on Dec. 2, was assigned to INNOGRATION (SUZHOU) Co. LTD. (Suzhou, China).

"Packaging structure and packaging method of high-power radio frequency device" was invented by Yinghao Zhuo (Suzhou, China), Zhimin Xiao (Suzhou, China) and Lei Zhu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses a packaging structure of a high-power radio frequency device, comprising a plurality of radio frequency power chips connected in parallel and a packaging flange; and the plurality of radio frequency power chips are arranged obliquely in a packaging cavity of the packaging flange, to reduce the number of input b...