ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,964, issued on Sept. 16, was assigned to INGENTEC Corp. (Zhunan Township, Miaoli County, Taiwan).
"Via-filling method of through-glass via substrate" was invented by Hsiao Lu Chen (Zhunan Township, Taiwan), Ai Sen Liu (Zhunan Township, Taiwan), Hsiang An Feng (Zhunan Township, Taiwan) and Ya Li Chen (Zhunan Township, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A via-filling method of a TGV substrate includes steps: filling a plurality of metal balls into a plurality of vias of the TGV substrate; using a heating process to melt the plurality of metal balls to form a liquid-state metal; and cooling down the liquid-state metal to form a soli...