US Patent Issued to INGENTEC on Sept. 16 for "Bonding and transferring method for die package structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,011, issued on Sept. 16, was assigned to INGENTEC Corp. (Miaoli County, Taiwan).

"Bonding and transferring method for die package structures" was invented by Hsiao Lu Chen (Zhunan Township, Taiwan), Ai Sen Liu (Zhunan Township, Taiwan), Hsiang An Feng (Zhunan Township, Taiwan) and Ya Li Chen (Zhunan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding and transferring method for die package structures is provided, including providing a die package structure which has a positioning adhesive disposed thereon, and providing a vibration base having at least one cavity corresponding to the positioning adhesive. By alignment of the p...